PLATERA

Live / Allowed — Approved for publication (as of 14 Sept 2026)

What this means for you

Approved and waiting on proof of use. It will register unless the applicant drops it, and its 13 May 2026 filing date already counts against anyone who files later.

Record

Serial number
99820028
Mark type
Stylized text
Filed
13 May 2026
Attorney of record
Alan Taboada

Goods and services

  • Class 007 — Machines and machine tools: Semiconductor manufacturing machines, namely, electrochemical plating (ECP) machines, substrate cleaning machines, and surface preparation machines for processing substrate, all for use in semiconductor manufacturing and advanced semiconductor packaging and structural parts and fittings therefor; Semiconductor manufacturing machines and apparatus incorporating artificial intelligence-powered automation systems for optimizing equipment operation and production scheduling.
  • Class 009 — Scientific and electric apparatus: Sensors and measuring instruments for monitoring and measuring the operation, condition, and performance of electrochemical plating (ECP), substrate cleaning, and surface preparation machines used in semiconductor manufacturing and advanced semiconductor packaging; downloadable computer software for controlling and operating electrochemical plating (ECP), substrate cleaning, and surface preparation machines, and for equipment monitoring, data acquisition, diagnostics, plating bath monitoring, process analytics, defect classification, yield analysis, and process optimization in semiconductor manufacturing and advanced semiconductor packaging

Owner

Prosecution history

  • 14 Sept 2026 — APPROVED FOR PUB - PRINCIPAL REGISTER
  • 25 Aug 2026 — TEAS/EMAIL CORRESPONDENCE ENTERED
  • 25 Aug 2026 — CORRESPONDENCE RECEIVED IN LAW OFFICE
  • 25 Aug 2026 — TEAS RESPONSE TO OFFICE ACTION RECEIVED
  • 24 Aug 2026 — NOTIFICATION OF NON-FINAL ACTION E-MAILED
  • 24 Aug 2026 — NON-FINAL ACTION E-MAILED
  • 24 Aug 2026 — NON-FINAL ACTION WRITTEN
  • 20 Aug 2026 — ASSIGNED TO EXAMINER
  • 31 Jul 2026 — NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
  • 13 May 2026 — APPLICATION FILING RECEIPT MAILED
  • 13 May 2026 — NEW APPLICATION ENTERED

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