SAMSUNG 2.3D CUBE-E
Live / Applied — Response to non-final action entered (as of 08 Sept 2026)
What this means for you
Not registered yet, but its 10 Feb 2026 filing date beats anything filed after it. If it registers, the owner can stop confusingly similar uses in the classes it covers.
Record
- Serial number
- 99644886
- Mark type
- Stylized text
- Filed
- 10 Feb 2026
- Attorney of record
- Daniel I. Schloss
Goods and services
- Class 009 — Scientific and electric apparatus: Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets.
- Class 040 — Treatment of materials: Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others.
- Class 042 — Scientific and technological services: Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing.
Owner
- SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-do, KR
Prior registrations
Prosecution history
- 08 Sept 2026 — TEAS/EMAIL CORRESPONDENCE ENTERED
- 08 Sept 2026 — CORRESPONDENCE RECEIVED IN LAW OFFICE
- 08 Sept 2026 — TEAS RESPONSE TO OFFICE ACTION RECEIVED
- 10 Jun 2026 — NOTIFICATION OF NON-FINAL ACTION E-MAILED
- 10 Jun 2026 — NON-FINAL ACTION E-MAILED
- 10 Jun 2026 — NON-FINAL ACTION WRITTEN
- 10 Jun 2026 — ASSIGNED TO EXAMINER
- 09 Jun 2026 — NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
- 10 Feb 2026 — APPLICATION FILING RECEIPT MAILED
- 10 Feb 2026 — NEW APPLICATION ENTERED