DTB
Live / Applied — New application — not yet assigned to an examiner (as of 14 Jan 2026)
What this means for you
Not registered yet, but its 14 Jan 2026 filing date beats anything filed after it. If it registers, the owner can stop confusingly similar uses in the classes it covers.
Record
- Serial number
- 99595335
- Mark type
- Stylized text
- Filed
- 14 Jan 2026
- Attorney of record
- Tomoko Nakajima
Goods and services
- Class 007 — Machines and machine tools: Semiconductor manufacturing machines; electric irradiation apparatus for use in the manufacture of semiconductors; Apparatus for adhesion of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Peeling apparatus of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Apparatus for adhesion for use in the manufacture of semiconductors; Bonding apparatus for use in the manufacture of semiconductors; Die bonders; Mounting apparatus for mounting IC chips and other electronic components onto circuit boards
- Class 017 — Rubber goods: Plastic semi-worked products; Adhesive or adhesive-coated plastic films and plastic sheets; Adhesive tapes and self-adhesive tapes for use in the processing of semiconductors; Adhesive tapes and self-adhesive tapes for use in the mounting of semiconductors; Tapes for use in the peeling of tapes for semiconductor wafer processing; Pressure-sensitive self-adhesive tapes and pressure-sensitive adhesive tapes for use in the manufacture of electronic parts; Protective tapes for the rear surfaces of semiconductor chips
- Class 040 — Treatment of materials: Laminating of adhesive tapes and self-adhesive tapes; Peeling of adhesive tapes and self-adhesive tapes; Treatment and processing of plastic films and sheets; Electron beam irradiation treatment for resin; Treatment and processing of semiconductors or wafers; Resin coating processing of semiconductors or wafers; Rental of semiconductor manufacturing machines and apparatus
Owner
- Lintec Kabushiki Kaisha, Tokyo, JP
- TAZMO CO., LTD., Okayama, JP
Prosecution history
- 14 Jan 2026 — APPLICATION FILING RECEIPT MAILED
- 14 Jan 2026 — NEW APPLICATION ENTERED