PCBL

What this means for you

Approved and waiting on proof of use. It will register unless the applicant drops it, and its 13 Mar 2025 filing date already counts against anyone who files later.

Record

Serial number

99082749

Mark type

Stylized text

Filed

13 Mar 2025

Published for opposition

03 Mar 2026

Attorney of record

Tomoko Nakajima

Goods and services

• Class 001 — Chemicals: Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin
• Class 007 — Machines and machine tools: semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors
• Class 017 — Rubber goods: Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets for use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips
• Class 040 — Treatment of materials: laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastic films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer

Owner

• Lintec Kabushiki Kaisha, Tokyo, JP
• Lintec Kabushiki Kaisha, Tokyo, JP

Prosecution history

• 03 Mar 2026 — OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
• 03 Mar 2026 — PUBLISHED FOR OPPOSITION
• 25 Feb 2026 — NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
• 06 Feb 2026 — APPROVED FOR PUB - PRINCIPAL REGISTER
• 03 Feb 2026 — TEAS/EMAIL CORRESPONDENCE ENTERED
• 03 Feb 2026 — CORRESPONDENCE RECEIVED IN LAW OFFICE
• 03 Feb 2026 — ASSIGNED TO LIE
• 27 Jan 2026 — TEAS RESPONSE TO SUSPENSION INQUIRY RECEIVED
• 14 Aug 2025 — NOTIFICATION OF LETTER OF SUSPENSION E-MAILED
• 14 Aug 2025 — LETTER OF SUSPENSION E-MAILED
• 14 Aug 2025 — SUSPENSION LETTER WRITTEN
• 14 Aug 2025 — EXAMINER'S AMENDMENT ENTERED
• 14 Aug 2025 — NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
• 14 Aug 2025 — EXAMINERS AMENDMENT E-MAILED
• 14 Aug 2025 — EXAMINERS AMENDMENT -WRITTEN