HANMI

Live / Registered — Registered (as of 05 Aug 2025)

What this means for you

Registered since 05 Aug 2025. The owner can stop confusingly similar uses in the classes it covers.

Class 007 — Machines and machine tools: Die attachment equipment for manufacturing semiconductor, namely, dies for use with machine tools; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; die bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; electronic components placement machines and apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; semiconductor chip mounting equipment in the nature of semiconductor manufacturing machines; semiconductor package electromagnetic shielding equipment in the nature of semiconductor manufacturing machines; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines