CU-BRITE
Live / Registered — Registered (as of 10 Jun 2025)
What this means for you
Registered since 10 Jun 2025. The owner can stop confusingly similar uses in the classes it covers.
Record
- Serial number
- 98428920
- Registration number
- 7822080
- Mark type
- Stylized text
- Filed
- 01 Mar 2024
- Published for opposition
- 22 Apr 2025
- Registered
- 10 Jun 2025
- Attorney of record
- Barry I. Hollander
Goods and services
- Class 001 — Chemicals: Industrial chemicals; chemicals for use in plating; metal plating solution; chemical metal plating solution; metal plating chemical compositions, namely, electrolytic acid copper solution; metal plating solution additive; chemical additive for use in the manufacture of metal plating solution; chemical metal plating solution additive; metal plating additives; chemical additives for use in metal plating; chemical metal plating additives; metal surface treatment agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical agents for use in the plating industry for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and plating chemicals for use in package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; metal plating solution, metal plating solution additive, metal plating additives for use in package substrate, and printed circuit boards; chemical metal plating solution, chemical metal plating solution additive, chemical metal plating additives for use in package substrate, and printed circuit boards; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in package substrate, and printed circuit boards
Owner
- JCU CORPORATION, Tokyo, JP
- JCU CORPORATION, Tokyo, JP
- JCU CORPORATION, Tokyo, JP
Prosecution history
- 10 Jun 2025 — NOTICE OF REGISTRATION CONFIRMATION EMAILED
- 10 Jun 2025 — REGISTERED-PRINCIPAL REGISTER
- 22 Apr 2025 — OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
- 22 Apr 2025 — PUBLISHED FOR OPPOSITION
- 16 Apr 2025 — NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
- 27 Mar 2025 — APPROVED FOR PUB - PRINCIPAL REGISTER
- 27 Mar 2025 — EXAMINER'S AMENDMENT ENTERED
- 27 Mar 2025 — NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
- 27 Mar 2025 — EXAMINERS AMENDMENT E-MAILED
- 27 Mar 2025 — EXAMINERS AMENDMENT -WRITTEN
- 06 Jan 2025 — APPLICATION EXTENSION GRANTED/RECEIPT PROVIDED
- 06 Jan 2025 — APPLICATION EXTENSION TO RESPONSE PERIOD - RECEIVED
- 04 Oct 2024 — NOTIFICATION OF NON-FINAL ACTION E-MAILED
- 04 Oct 2024 — NON-FINAL ACTION E-MAILED
- 04 Oct 2024 — NON-FINAL ACTION WRITTEN