NEZARK
Live / Applied — Second extension granted (statement of use) (as of 25 Nov 2025)
What this means for you
Not registered yet, but its 14 Nov 2023 filing date beats anything filed after it. If it registers, the owner can stop confusingly similar uses in the classes it covers.
Record
- Serial number
- 98269503
- Mark type
- Stylized text
- Filed
- 14 Nov 2023
- Published for opposition
- 22 Oct 2024
- Attorney of record
- Barry I. Hollander
Goods and services
- Class 001 — Chemicals: Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards
Owner
- JCU CORPORATION, Tokyo, JP
- JCU CORPORATION, Tokyo, JP
Prosecution history
- 24 Mar 2026 — TEAS STATEMENT OF USE RECEIVED
- 26 Nov 2025 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 25 Nov 2025 — SOU EXTENSION 2 GRANTED
- 25 Nov 2025 — SOU EXTENSION 2 FILED
- 25 Nov 2025 — SOU TEAS EXTENSION RECEIVED
- 09 May 2025 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 08 May 2025 — SOU EXTENSION 1 GRANTED
- 08 May 2025 — SOU EXTENSION 1 FILED
- 08 May 2025 — SOU TEAS EXTENSION RECEIVED
- 03 Dec 2024 — NOA E-MAILED - SOU REQUIRED FROM APPLICANT
- 22 Oct 2024 — OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
- 22 Oct 2024 — PUBLISHED FOR OPPOSITION
- 02 Oct 2024 — NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
- 12 Sept 2024 — APPROVED FOR PUB - PRINCIPAL REGISTER
- 12 Sept 2024 — EXAMINER'S AMENDMENT ENTERED