HSP

Dead / Abandoned — Abandoned — no statement of use filed (as of 27 Oct 2025)

What this means for you

This application is over — abandoned 27 Oct 2025. The name may be available, but check before relying on it — rights can also come from actual use, not only from the register.

Record

Serial number
90877083
Mark type
Stylized text
Filed
11 Aug 2021
Published for opposition
26 Jul 2022
Abandoned
27 Oct 2025
Attorney of record
Kumiko Ide

Goods and services

  • Class 001 — Chemicals: Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components
  • Class 002 — Paints: Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink
  • Class 017 — Rubber goods: Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials

Owner

Prosecution history

  • 27 Oct 2025 — ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED
  • 27 Oct 2025 — ABANDONMENT - NO USE STATEMENT FILED
  • 25 Apr 2025 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
  • 24 Apr 2025 — SOU EXTENSION 5 GRANTED
  • 07 Jan 2025 — SOU EXTENSION 5 FILED
  • 14 Apr 2025 — CASE ASSIGNED TO INTENT TO USE PARALEGAL
  • 07 Jan 2025 — SOU TEAS EXTENSION RECEIVED
  • 29 Jul 2024 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
  • 29 Jul 2024 — SOU EXTENSION 4 GRANTED
  • 29 Jul 2024 — SOU EXTENSION 4 FILED
  • 29 Jul 2024 — SOU TEAS EXTENSION RECEIVED
  • 03 Feb 2024 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
  • 01 Feb 2024 — SOU EXTENSION 3 GRANTED
  • 01 Feb 2024 — SOU EXTENSION 3 FILED
  • 01 Feb 2024 — SOU TEAS EXTENSION RECEIVED

View this trademark record on Marksy