Serial 88806340
Dead / Abandoned — Abandoned — no statement of use filed (as of 10 Oct 2022)
What this means for you
This application is over — abandoned 10 Oct 2022. The name may be available, but check before relying on it — rights can also come from actual use, not only from the register.
Record
- Serial number
- 88806340
- Mark type
- Design / logo
- Filed
- 21 Feb 2020
- Published for opposition
- 14 Jul 2020
- Abandoned
- 10 Oct 2022
- Attorney of record
- Julie B. Albert
Goods and services
- Class 001 — Chemicals: Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA), and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (CMP) slurry and chemical mechanical planarization (CMP) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
- Class 003 — Cosmetics and cleaning preparations: Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
- Class 007 — Machines and machine tools: Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
Owner
- CMC MATERIALS, INC., AURORA, IL, US
- Cabot Microelectronics Corporation, Aurora, IL, US
- Cabot Microelectronics Corporation, Aurora, IL, US
Prosecution history
- 11 Oct 2022 — ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED
- 10 Oct 2022 — ABANDONMENT - NO USE STATEMENT FILED
- 12 Jul 2022 — TEAS CHANGE OF CORRESPONDENCE RECEIVED
- 12 Jul 2022 — TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS
- 12 Jul 2022 — ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
- 12 Jul 2022 — TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
- 18 Mar 2022 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 17 Mar 2022 — SOU EXTENSION 3 GRANTED
- 07 Mar 2022 — SOU EXTENSION 3 FILED
- 17 Mar 2022 — CASE ASSIGNED TO INTENT TO USE PARALEGAL
- 07 Mar 2022 — SOU TEAS EXTENSION RECEIVED
- 09 Sept 2021 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 07 Sept 2021 — SOU EXTENSION 2 GRANTED
- 07 Sept 2021 — SOU EXTENSION 2 FILED
- 07 Sept 2021 — SOU TEAS EXTENSION RECEIVED