CMC MATERIALS
Live / Registered — Registered (as of 08 Mar 2022)
What this means for you
Registered since 08 Mar 2022. The owner can stop confusingly similar uses in the classes it covers.
Record
- Serial number
- 88698404
- Registration number
- 6667318
- Mark type
- Stylized text
- Filed
- 19 Nov 2019
- Published for opposition
- 26 May 2020
- Registered
- 08 Mar 2022
- Attorney of record
- Cynthia Johnson Walden
Goods and services
- Class 001 — Chemicals: Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA) and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemicals, namely, polymer-containing drag reducers and flow improvers to increase flow of hydrocarbons through pipelines; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
- Class 003 — Cosmetics and cleaning preparations: Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
- Class 004 — Lubricants and fuels: Industrial lubricants, namely, valve lubricants for the oil and gas storage, pipeline and gas distribution markets; Industrial lubricants and greases
- Class 007 — Machines and machine tools: Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
Owner
- CMC MATERIALS LLC, WILMINGTON, DE, US
- CMC MATERIALS, INC., AURORA, IL, US
- CMC MATERIALS, INC., AURORA, IL, US
- Cabot Microelectronics Corporation, Aurora, IL, US
- Cabot Microelectronics Corporation, Aurora, IL, US
Prosecution history
- 18 Oct 2023 — AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
- 09 Aug 2023 — TEAS CHANGE OF CORRESPONDENCE RECEIVED
- 09 Aug 2023 — ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
- 09 Aug 2023 — TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
- 09 Aug 2023 — APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
- 09 Aug 2023 — TEAS CHANGE OF OWNER ADDRESS RECEIVED
- 08 Mar 2022 — REGISTERED-PRINCIPAL REGISTER
- 02 Feb 2022 — NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
- 01 Feb 2022 — ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
- 01 Feb 2022 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 31 Jan 2022 — STATEMENT OF USE PROCESSING COMPLETE
- 21 Jan 2022 — USE AMENDMENT FILED
- 31 Jan 2022 — SOU EXTENSION 3 GRANTED
- 21 Jan 2022 — SOU EXTENSION 3 FILED
- 31 Jan 2022 — CASE ASSIGNED TO INTENT TO USE PARALEGAL