STEALTH DICING
Live / Registered — Registered — Sections 8 & 15 accepted and acknowledged (as of 22 Mar 2025)
What this means for you
Registered since 26 Feb 2019. The owner can stop confusingly similar uses in the classes it covers.
Record
- Serial number
- 86598182
- Registration number
- 5686410
- Mark type
- Stylized text
- Filed
- 15 Apr 2015
- Published for opposition
- 27 Oct 2015
- Registered
- 26 Feb 2019
- Attorney of record
- Scott S. Havlick
Goods and services
- Class 040 — Treatment of materials: Treatment of materials, namely, dicing semiconductor wafers; treatment of materials by laser beam
Owner
- HAMAMATSU PHOTONICS K.K., Shizuoka, JP
- HAMAMATSU PHOTONICS K.K., Shizuoka, JP
- HAMAMATSU PHOTONICS K.K., Shizuoka, JP
Prosecution history
- 22 Mar 2025 — NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
- 22 Mar 2025 — REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
- 22 Mar 2025 — CASE ASSIGNED TO POST REGISTRATION PARALEGAL
- 02 Dec 2024 — TEAS SECTION 8 & 15 RECEIVED
- 26 Feb 2024 — COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED
- 26 Feb 2019 — REGISTERED-PRINCIPAL REGISTER
- 19 Jan 2019 — NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
- 18 Jan 2019 — ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
- 27 Dec 2018 — STATEMENT OF USE PROCESSING COMPLETE
- 19 Dec 2018 — USE AMENDMENT FILED
- 19 Dec 2018 — TEAS STATEMENT OF USE RECEIVED
- 09 Jun 2018 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 08 Jun 2018 — SOU EXTENSION 5 GRANTED
- 06 Jun 2018 — SOU EXTENSION 5 FILED
- 08 Jun 2018 — CASE ASSIGNED TO INTENT TO USE PARALEGAL