FORTIBOND
Dead / Abandoned — Abandoned — no statement of use filed (as of 06 Aug 2018)
What this means for you
This application is over — abandoned 06 Aug 2018. The name may be available, but check before relying on it — rights can also come from actual use, not only from the register.
Record
- Serial number
- 85837492
- Mark type
- Stylized text
- Filed
- 31 Jan 2013
- Published for opposition
- 10 Nov 2015
- Abandoned
- 06 Aug 2018
- Attorney of record
- Arthur G. Schaier
Goods and services
- Class 001 — Chemicals: Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die either with flip chip wafer bumping or wire bonded type, onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes for production of electrical and thermal interconnect lines and patterns circuitry, pads; Printable pastes for via-fill applications; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device
- Class 002 — Paints: Printable or dispensable or jettable inks composed of silver powder mixed with epoxy material all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device; pastes for reflective layer printing or transfer composed of silver powder mixed with epoxy material
- Class 017 — Rubber goods: Transferable semi-finished films for wafer-to-wafer bonding, attachment of semiconductor die either flip chip or wire bonded, onto a variety of substrates, and hermetic/near hermetic packaging; semi-finished films for reflective layer printing or transfer; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device
Owner
- ALPHA ASSEMBLY SOLUTIONS INC., SOMERSET, NJ, US
- ALPHA METALS, INC., SOUTH PLAINFIELD, NJ, US
- ALPHA METALS, INC., SOUTH PLAINFIELD, NJ, US
- Fry's Metals, Inc., South Plainfied, NJ, US
Prosecution history
- 06 Aug 2018 — ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED
- 06 Aug 2018 — ABANDONMENT - NO USE STATEMENT FILED
- 05 Jan 2018 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 03 Jan 2018 — SOU EXTENSION 4 GRANTED
- 03 Jan 2018 — SOU EXTENSION 4 FILED
- 03 Jan 2018 — SOU TEAS EXTENSION RECEIVED
- 04 Jul 2017 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 30 Jun 2017 — SOU EXTENSION 3 GRANTED
- 30 Jun 2017 — SOU EXTENSION 3 FILED
- 30 Jun 2017 — SOU TEAS EXTENSION RECEIVED
- 28 Feb 2017 — ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
- 28 Feb 2017 — TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
- 27 Dec 2016 — NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
- 24 Dec 2016 — SOU EXTENSION 2 GRANTED
- 06 Dec 2016 — SOU EXTENSION 2 FILED