SHB2 NANO
Live / Applied — New application — not yet assigned to an examiner (as of 03 Sept 2026)
What this means for you
Not registered yet, but its 11 Jun 2026 filing date beats anything filed after it. If it registers, the owner can stop confusingly similar uses in the classes it covers.
Record
- Serial number
- 79457253
- Mark type
- Word mark
- Filed
- 11 Jun 2026
Goods and services
- Class 007 — Machines and machine tools: Bonding machine for semiconductor processing; machines for assembling semiconductor components; die bonder for semiconductor manufacturing; electronic chip assembly and packaging device for semiconductor manufacturing; flip-chip bonder for semiconductor manufacturing; hybrid bonder for semiconductor manufacturing; semiconductor processing machines; apparatus for manufacturing semiconductors; cluster tool integration platform for integrated circuit and semiconductor device manufacturing; cluster tool integration platform for manufacturing integrated circuits and semiconductor devices including a hybrid bonder; integrated tool for performing hybrid bonding chip packaging technology (semiconductor wafer processing equipment); integrated platform for cluster tools used in the manufacturing of integrated circuits and semiconductor devices for hybrid bonding chip packaging technology.
Owner
Prosecution history
- 09 Sept 2026 — APPLICATION FILING RECEIPT MAILED
- 09 Sept 2026 — NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
- 03 Sept 2026 — SN ASSIGNED FOR SECT 66A APPL FROM IB