BONDTECH

Live / Registered — Registered (as of 08 Oct 2024)

What this means for you

Registered since 08 Oct 2024. The owner can stop confusingly similar uses in the classes it covers.

Record

Serial number: 79364266
Registration number: 7525561
Mark type: Design + words
Filed: 27 Jul 2022
Published for opposition: 23 Jul 2024
Registered: 08 Oct 2024
Attorney of record: Shintaro Yamada

Goods and services

Class 007 — Machines and machine tools: Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; machine couplings and transmission components and machine elements in the nature of shock prevention devices for semiconductor manufacturing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and semiconductor exposure apparatuses for use in manufacture, and structural components thereof; positioning devices for semiconductor manufacturing equipment, namely, ball transfer units, and components thereof, namely, bearings, as parts of machines; hydraulic and pneumatic controls for semiconductor manufacturing equipment, and components thereof, namely, hydraulic valves being parts of machines, and oil-water separators for pneumatic controls being parts of machines; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines and exposure apparatuses for use in manufacture; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; machines for nanoimprint lithography (NIL) for semiconductor manufacturing; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing and marking machines and components and appendages in the nature of parts thereof; equipment for cleaning microelectromechanical systems (MEMS), namely, dust removing installations for cleaning purposes, and components and appendages in the nature of parts thereof; cleaning devices for semiconductor manufacturing, namely, cleaning machines for semiconductor manufacturing machines; devices in the nature of machines for mounting IC chips on circuit boards; plasma etching machines; semiconductor exposure devices, namely, apparatus for use in manufacture; semiconductor cutting devices being parts of machines; semiconductor polishing devices being parts of machines; semiconductor plating devices being parts of machines; semiconductor etching devices being parts of machines; semiconductor thin-film formation devices being parts of machines; none of the aforementioned goods being 3D printers or machines for moulding plastics, or parts or fittings thereof
Class 037 — Building construction and repair services: Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of positioning devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of control devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of machines for nanoimprint lithography (NIL) for semiconductor manufacturing, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of equipment for cleaning microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of cleaning devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of wafer foreign matter inspection devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of plasma etching machines, and providing information related thereto; repair and maintenance of semiconductor exposure devices, and providing information related thereto; repair and maintenance of semiconductor cutoff devices, and providing information related thereto; repair and maintenance of semiconductor polishing devices, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor etching devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of semiconductor drying devices, and providing information related thereto; cleaning of machines and apparatuses for semiconductor manufacturing; cleaning of semiconductor manufacturing equipment; installation work of semiconductor testing equipment, and providing information related thereto; installation work of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto; installation work, repair, and maintenance of computer hardware, and providing information related thereto; none of the aforementioned services being intended for 3D printers or for machines for moulding plastics, or parts thereof

Owner

Prosecution history

18 Dec 2025 — TEAS CHANGE OF CORRESPONDENCE RECEIVED
18 Dec 2025 — TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
18 Dec 2025 — ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
18 Dec 2025 — TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
04 Apr 2025 — FINAL DECISION TRANSACTION PROCESSED BY IB
14 Mar 2025 — FINAL DISPOSITION NOTICE SENT TO IB
14 Mar 2025 — FINAL DISPOSITION PROCESSED
08 Jan 2025 — FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
08 Oct 2024 — NOTICE OF REGISTRATION CONFIRMATION EMAILED
08 Oct 2024 — REGISTERED-PRINCIPAL REGISTER
17 Aug 2024 — NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
31 Jul 2024 — NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
31 Jul 2024 — NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
23 Jul 2024 — OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
23 Jul 2024 — PUBLISHED FOR OPPOSITION

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