NOVASIC
Live / Registered — Registered (as of 28 May 2024)
What this means for you
Registered since 28 May 2024. The owner can stop confusingly similar uses in the classes it covers.
Record
- Serial number
- 79358894
- Registration number
- 7394032
- Mark type
- Stylized text
- Filed
- 27 Sept 2022
- Published for opposition
- 12 Mar 2024
- Registered
- 28 May 2024
- Attorney of record
- Mari-Elise Paul
Goods and services
- Class 009 — Scientific and electric apparatus: Single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different machining operations, namely, operations for conducting cuts, meplats, bevels; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface preparation operations ready for epitaxy or bonding, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components; all these goods being used in precision grinding, mechanical and chemical mechanical polishing (CMP) operations and other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling
- Class 040 — Treatment of materials: mechanical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to machining operations, namely, processing for conducting cuts, meplats, bevels; mechanical, chemical and optical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to for surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; other mechanical, chemical and physical surface treatments, , used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; surface characterization process being, physical, chemical and optical, namely, topography, roughness and chemical analysis; structure characterization method being chemical or physical, namely, morphology and crystal structure; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling
- Class 042 — Scientific and technological services: Testing of machining techniques, namely, technical tests and trials for conducting cuts, meplats, bevels; testing and tests of surface preparation techniques, namely, technical testing and testing of lapping, precision grinding, mechanical and chemical mechanical polishing (CMP), cleaning, laser marking; technical tests of other surface treatments for others in the field of materials used to for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; research and development for new products for others; research and development of new consumable products for others used in machining operations, namely, operations for conducting cuts, meplats, bevels; research and development of new consumable products for others for use in surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; research and development of new consumables for others used in other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for conducting machining operations, namely, operations for conducting cuts, meplats, bevels; technical advice for conducting surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; technical advice for conducting other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for surface characterization, namely, topography, roughness and chemical analysis; technical advice for structure characterization, namely, morphology and crystallography; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding
Owner
Prosecution history
- 30 Nov 2024 — FINAL DECISION TRANSACTION PROCESSED BY IB
- 12 Nov 2024 — FINAL DISPOSITION NOTICE SENT TO IB
- 12 Nov 2024 — FINAL DISPOSITION PROCESSED
- 28 Aug 2024 — FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
- 28 May 2024 — NOTICE OF REGISTRATION CONFIRMATION EMAILED
- 28 May 2024 — REGISTERED-PRINCIPAL REGISTER
- 11 Apr 2024 — TEAS CHANGE OF CORRESPONDENCE RECEIVED
- 11 Apr 2024 — TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
- 11 Apr 2024 — ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
- 11 Apr 2024 — TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
- 12 Mar 2024 — OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
- 12 Mar 2024 — NOTIFICATION PROCESSED BY IB
- 12 Mar 2024 — PUBLISHED FOR OPPOSITION
- 21 Feb 2024 — NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
- 21 Feb 2024 — NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED