ELITECSP
Dead / Cancelled — Cancelled — Section 8 (as of 08 Jun 2018)
What this means for you
This registration has been cancelled; it no longer blocks anyone on its own. The name may be available, but check before relying on it — rights can also come from actual use, not only from the register.
Record
- Serial number
- 78843235
- Registration number
- 3332305
- Mark type
- Stylized text
- Filed
- 22 Mar 2006
- Published for opposition
- 14 Nov 2006
- Registered
- 06 Nov 2007
- Attorney of record
- John E. Cummerford
Goods and services
- Class 040 — Treatment of materials: Custom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of solder spheres to electroless metal on semiconductor wafers and chips
Owner
- FlipChip International, LLC, Phoenix, AZ, US
- FlipChip International, LLC, Phoenix, AZ, US
- FlipChip International, LLC, Phoenix, AZ, US
Prosecution history
- 08 Jun 2018 — CANCELLED SEC. 8 (10-YR)/EXPIRED SECTION 9
- 06 Nov 2016 — COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
- 30 Jul 2014 — NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
- 30 Jul 2014 — REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
- 30 Jul 2014 — CORRECTION UNDER SECTION 7 - PROCESSED
- 20 Mar 2014 — TEAS RESPONSE TO OFFICE ACTION-POST REG RECEIVED
- 07 Nov 2013 — POST REGISTRATION ACTION MAILED - SEC. 8 & 15
- 07 Nov 2013 — CASE ASSIGNED TO POST REGISTRATION PARALEGAL
- 22 Oct 2013 — TEAS SECTION 8 & 15 RECEIVED
- 06 Nov 2007 — REGISTERED-PRINCIPAL REGISTER
- 03 Oct 2007 — LAW OFFICE REGISTRATION REVIEW COMPLETED
- 02 Oct 2007 — ASSIGNED TO LIE
- 03 Sept 2007 — ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
- 30 Aug 2007 — STATEMENT OF USE PROCESSING COMPLETE
- 30 Aug 2007 — SOU EXTENSION 1 GRANTED