KS

Live / Registered — Registered and renewed (as of 14 Jun 2024)

What this means for you

Registered since 02 Dec 2003. The owner can stop confusingly similar uses in the classes it covers; it stays on the register as long as the owner keeps up the maintenance filings (next due by 02 Dec 2023).

Record

Serial number
76328762
Registration number
2788019
Mark type
Word mark
Filed
24 Oct 2001
Published for opposition
09 Sept 2003
Registered
02 Dec 2003
Next maintenance due
02 Dec 2023
Attorney of record
Christopher M. Spletzer, Sr.

Goods and services

  • Class 007 — Machines and machine tools: Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equipment for bonding stud bumps onto a silicon wafer; [ and wafer preparation equipment, namely, semiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame ]
  • Class 008 — Hand tools: Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders
  • Class 009 — Scientific and electric apparatus: Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; ] factory automation software, namely, software designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; [ wafer test products, namely, semiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test products, namely, electrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates ]
  • Class 035 — Advertising and business services: Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, wafer test products and package test products, ] and on-line customer support services [ relating thereto ], namely, on-line supply, on-line logistics and support, on-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times
  • Class 037 — Building construction and repair services: Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment
  • Class 040 — Treatment of materials: [Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors;] [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ]
  • Class 041 — Education and entertainment services: Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ]
  • Class 042 — Scientific and technological services: Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites; design and fabrication services for others, namely, design and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digital, analog and mix signal circuit boards; ] technical support services rendered in person, via telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor

Owner

Prosecution history

  • 14 Jun 2024 — NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED
  • 14 Jun 2024 — REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS)
  • 14 Jun 2024 — REGISTERED - SEC. 9 GRANTED/CHECK RECORD FOR SEC. 8
  • 14 Jun 2024 — REGISTERED - PARTIAL SEC. 8 (10-YR) ACCEPTED
  • 14 Jun 2024 — CASE ASSIGNED TO POST REGISTRATION PARALEGAL
  • 13 Mar 2024 — TEAS SECTION 8 & 9 RECEIVED
  • 02 Dec 2022 — COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
  • 29 Jan 2018 — ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
  • 29 Jan 2018 — TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
  • 17 Jun 2014 — NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
  • 17 Jun 2014 — REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
  • 17 Jun 2014 — REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
  • 17 Jun 2014 — CASE ASSIGNED TO POST REGISTRATION PARALEGAL
  • 30 May 2014 — TEAS SECTION 8 & 9 RECEIVED
  • 04 Jan 2010 — REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.

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