IZM
Live / Registered — Registered and renewed (as of 27 Nov 2023)
What this means for you
Registered since 07 Jan 2003. The owner can stop confusingly similar uses in the classes it covers; it stays on the register as long as the owner keeps up the maintenance filings (next due by 07 Jan 2023).
Record
- Serial number
- 76216769
- Registration number
- 2671203
- Mark type
- Word mark
- Filed
- 27 Feb 2001
- Published for opposition
- 15 Oct 2002
- Registered
- 07 Jan 2003
- Next maintenance due
- 07 Jan 2023
- Attorney of record
- Jeffrey H. Handelsman
Goods and services
- Class 041 — Education and entertainment services: PUBLICATION OF BOOKS, BROCHURES, JOURNALS, MAGAZINES, MANUALS, DATASHEETS AND LEAFLETS IN THE FIELD OF ARCHITECTURE STRUCTURE AND MOUNTING TECHNOLOGY OF ELECTRONIC AND MICRO-ENGINEERING FUNCTIONAL PATTERNS; EDUCATION SERVICES IN THE NATURE OF COURSES AT THE UNIVERSITY LEVEL TEACHING; TRAINING SERVICES AND EDUCATIONAL SERVICES, NAMELY CONDUCTING SEMINARS, CONFERENCES, WORKSHOPS AND TUTORIALS IN THE FIELD OF ARCHITECTURE STRUCTURE AND MOUNTING TECHNOLOGY OF ELECTRONIC AND MICRO-ENGINEERING FUNCTIONAL PATTERNS, DISTRIBUTING COURSE MATERIALS IN CONNECTION THEREWITH
- Class 042 — Scientific and technological services: SCIENTIFIC AND LABORATORY RESEARCH, PRODUCT DEVELOPMENT AND DEVELOPMENT OF NEW TECHNOLOGY FOR OTHERS IN THE FIELD OF ELECTRONICS AND MICROELECTRONICS; PRODUCT DEVELOPMENT, DESIGN AND TESTING FOR NEW PRODUCT DEVELOPMENT IN THE FIELD OF MICROSYSTEM ENGINEERING COMPONENTS; SCIENTIFIC RESEARCH, DESIGN AND TESTING FOR NEW PRODUCT DEVELOPMENT, CONDUCTING OF FEASIBILITY STUDIES AND QUALITY CONTROL IN THE FIELD OF METROLOGICAL TECHNOLOGIES, MATERIAL SCIENCE, WAFER PROCESSING, CHIP MOUNTING TECHNOLOGIES AND SURFACE MOUNTING TECHNOLOGIES; TESTING, ANALYSIS AND EVALUATION OF MECHANICAL AND ELECTRICAL RELIABILITY IN THE FIELD OF MICRONICS; TESTING, ANALYSIS AND EVALUATION OF THE GOODS AND PRODUCTS OF OTHERS FOR THE PURPOSE OF LIFETIME ESTIMATIONS; DEVELOPMENT OF NEW TECHNOLOGIES FOR OTHERS IN THE FIELD OF PACKAGING TECHNOLOGIES, SYSTEM PACKAGING TECHNIQUES AND THREE-DIMENSIONAL ON-CHIP INTEGRATION TECHNOLOGIES; DEVELOPMENT OF NEW TECHNOLOGIES FOR OTHERS IN THE FIELD OF ESD PROTECTIVE STRUCTURES, TESTING, ANALYSIS AND EVALUATION OF THESE STRUCTURES; DESIGN AND TESTING OF NEW PRODUCTS FOR OTHERS IN THE FIELD OF MICROELECTRONIC AND MICROSYSTEM ENGINEERING COMPONENTS, OF THE COMPLEX MODULES, MINIATURIZED SYSTEMS AND ACTIVE AND PASSIVEPROBE CARDS; CONDUCTING OF FEASIBILITY STUDIES AND ENGINEERING SURVEYS TO OTHERS AND TECHNICAL CONSULTATION IN THE FIELD OF NEW TECHNOLOGIES BY MEANS OF AUTOMATIC PRODUCTION LINES; SCIENTIFIC AND LABORATORY RESEARCH, PRODUCT DEVELOPMENT AND DEVELOPMENT OF NEW TECHNOLOGY FOR OTHER SIN THE FIELD OF SEMICONDUCTORS, METALS AND POLYMERS; TECHNICAL CONSULTATION IN THE FIELD OF ECOLOGY, RECYCLING AND ECONOMY OF TECHNOLOGIES
Owner
Prosecution history
- 27 Nov 2023 — NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
- 27 Nov 2023 — REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS)
- 27 Nov 2023 — REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
- 18 Nov 2023 — CASE ASSIGNED TO POST REGISTRATION PARALEGAL
- 24 May 2023 — TEAS SECTION 8 & 9 RECEIVED
- 07 Jan 2022 — COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
- 16 Jan 2013 — NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
- 16 Jan 2013 — REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
- 16 Jan 2013 — REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
- 16 Jan 2013 — CASE ASSIGNED TO POST REGISTRATION PARALEGAL
- 19 Dec 2012 — TEAS SECTION 8 & 9 RECEIVED
- 20 Dec 2008 — REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
- 17 Dec 2008 — ASSIGNED TO PARALEGAL
- 11 Dec 2008 — TEAS SECTION 8 & 15 RECEIVED
- 20 Mar 2008 — CASE FILE IN TICRS