ALPHA-FRY TECHNOLOGIES
Dead / Cancelled — Cancelled — Section 8 (as of 20 Jul 2012)
What this means for you
This registration has been cancelled; it no longer blocks anyone on its own. The name may be available, but check before relying on it — rights can also come from actual use, not only from the register.
Record
- Serial number
- 76057743
- Registration number
- 3029558
- Mark type
- Word mark
- Filed
- 25 May 2000
- Published for opposition
- 04 Jun 2002
- Registered
- 13 Dec 2005
- Attorney of record
- William M. Borchard
Goods and services
- Class 001 — Chemicals: CHEMICALS FOR USE IN THE MANUFACTURE AND ASSEMBLY OF PRINTED CIRCUITS, ELECTRONIC COMPONENTS AND SEMICONDUCTOR PACKAGES; CHEMICAL COMPOUNDS, NAMELY, RESIN COATINGS USED AS TEMPORARY SOLDER MASKS TO PREVENT THE ADHERENCE OF SOLDER TO BASE METAL FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; THERMOPLASTIC PASTE ADHESIVES FOR USE IN THE MANUFACTURE OF ELECTRONIC ASSEMBLIES; SOLDERING CHEMICALS, NAMELY, AQUEOUS MACHINE DESCALERS FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; CHEMICAL PREPARATIONS IN THE NATURE OF RUST INHIBITORS; SOLDERING FLUX; WATER SOLUBLE SOLDERING FLUX; LOW SOLIDS SOLDER FLUX; SOLDERING FLUX, ZINC CHLORIDE TYPE; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; FLUXES USED FOR SOLDERING ELECTRONIC CIRCUITS, WHICH DO NOT REQUIRE CLEANING AFTER SAID USE; OXIDATION CHEMICALS FOR PROTECTING THE SURFACE TO WHICH THEY ARE APPLIED FOR USE IN CONNECTION WITH SOLDER; SILVER/GLASS DIE ATTACH MATERIAL ADHESIVES FOR USE IN SILICON CHIP BINDING; CHEMICAL PREPARATIONS FOR SOLDERING, NAMELY, SOLDERING INJECTION CHEMICALS TO REDUCE OXIDE FORMATION ON BRIDGE CONDUCTION LINES, SURFACE CONDITIONING CHEMICALS TO PREPARE SURFACES FOR SOLDERING; PROTECTIVE CHEMICAL COATINGS TO MAINTAIN SOLDERABILITY OF SURFACES; ULTRAVIOLET CURABLE POLYMERS FOR USE IN LEGEND INKS, SOLDER MASKS AND ETCHING/PLATING RESISTS; SOLDERING CHEMICALS, NAMELY, AQUEOUS RESIST STRIPPER FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY
- Class 003 — Cosmetics and cleaning preparations: ORGANIC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; SOLDERING AND PRINTED CIRCUIT CHEMICALS, NAMELY, ALKALI CLEANERS, DEGREASING SOLVENTS, FLUX REMOVER, METAL CLEANER, PAINT STRIPPERS AND VARNISH REMOVER, WIRE STRIPPING PREPARATION FOR REMOVING INSULATION FROM METAL, SILK SCREEN INK REMOVER, SOLDER RESIST REMOVING PREPARATION; SOLVENT AND AQUEOUS CLEANERS TO REMOVE RESIDUES AND CONTAMINANTS BEFORE AND AFTER SOLDERING; CHEMICAL CLEANER AND ROSIN FLUX REMOVER FOR USE IN ROSIN MILDLY ACTIVATED PASTE APPLICATIONS, NAMELY, CLEANING COMPOUND FOR SOLDER PLATED PRINTED CIRCUITS
- Class 006 — Metal goods: TIN AND LEAD EUTECTIC SOLDER; WATER SOLUBLE ORGANIC FLUX CORED SOLDER WIRE; COATED METAL STRIP; SOLDERS COMPOSED PRIMARILY OF LEAD AND TIN; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER; LASER CUT METAL STENCILS FOR USE IN THE ASSEMBLY OF ELECTRONIC COMPONENTS; SOLDER METAL ALLOY THAT IS TREATED TO INHIBIT DROSS FORMATION AND INCREASE FLUIDITY FOR USE IN SOLDERING APPLICATIONS; PASTES CONTAINING METAL POWDER FOR USE IN COPPER BRAZING; FLUX CORED WIRE SOLDER FOR USE IN THE ELECTRONICS INDUSTRY
Owner
- Fry's Metals, Inc., JERSEY CITY, NJ, US
- Fry's Metals, Inc., JERSEY CITY, NJ, US
- Fry's Metals, Inc., Providence, RI, US
Prior registrations
Prosecution history
- 20 Jul 2012 — CANCELLED SEC. 8 (6-YR)
- 13 Dec 2005 — REGISTERED-PRINCIPAL REGISTER
- 01 Nov 2005 — LAW OFFICE REGISTRATION REVIEW COMPLETED
- 28 Oct 2005 — ASSIGNED TO LIE
- 25 Oct 2005 — ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
- 13 Sept 2005 — STATEMENT OF USE PROCESSING COMPLETE
- 26 Aug 2005 — USE AMENDMENT FILED
- 30 Aug 2005 — PAPER RECEIVED
- 24 Jan 2005 — SOU EXTENSION 5 GRANTED
- 06 Jan 2005 — SOU EXTENSION 5 FILED
- 06 Jan 2005 — SOU TEAS EXTENSION RECEIVED
- 28 Oct 2004 — SOU EXTENSION 4 GRANTED
- 22 Aug 2004 — SOU EXTENSION 4 FILED
- 29 Jul 2004 — CASE FILE IN TICRS
- 22 Jul 2004 — SOU TEAS EXTENSION RECEIVED